Thermodynamic applications in material scienceSESTAK, JAROSLAV; STEPANEK, BEDRICH.Journal of thermal analysis. 1995, Vol 43, Num 2, issn 0368-4466, 183 p.Conference Proceedings

Application of the thermal analysis for detection of the resinoid bond influence on quality of the compositionsVACULIK, L.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 517-519, issn 0368-4466Conference Paper

Kinetic analysis of the process of thermal degradation of poly-N-vinylcarbazole and its derivativesPIELICHOWSKI, K.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 509-511, issn 0368-4466Conference Paper

Thermodynamic stability of phases in the Bi-Sr-Cu-(O) systemNEVRIVA, M; SEDMIDUBSKY, D.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 449-460, issn 0368-4466Conference Paper

Application of thermal analysis for the investigation of polymer degradation processesPIELICHOWSKI, J; PIELICHOWSKI, K.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 505-508, issn 0368-4466Conference Paper

Calorimetry of building materialsTOMAN, J; CERNY, R.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 489-496, issn 0368-4466Conference Paper

Reactions between YBa₂Cu₃O_7-δ and La₂O₃ and SrCO₃HEGEDÜS, Z.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 461-468, issn 0368-4466Conference Paper

The comparison of the current and the enthalpy during cure of the compositionsVACULIK, L.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 513-516, issn 0368-4466Conference Paper

Binary alloys as a model for the multicultural societyMIMKES, J.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 521-537, issn 0368-4466Conference Paper

Thermochemical and thermodynamical properties of some compounds in the system Ga-Sb-SMOISEEV, G; SESTAK, J.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 539-544, issn 0368-4466Conference Paper

Differences in partial thermodynamic functions of some sections of systems Tl-Ag-Te and Tl-Sb-TeZALESKA, E; SZTUBA, Z; FUGLEWICZ, B et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 411-416, issn 0368-4466Conference Paper

Phase equilibria in the system FeVO₄-Fe₂WO₆ in the solid stateWALCZAK, J; RYCHŁOWSKA-HIMMEL, I.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 433-438, issn 0368-4466Conference Paper

Nonequilibrium phase diagrams in the PbCl₂-AgCl eutectic systemCHVOJ, Z; SESTAK, J; FENDRYCH, F et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 439-448, issn 0368-4466Conference Paper

Materials engineering for optoelectronic crystals related to III-V compoundsVENKRBEC, J. J; KOUSAL, J.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 377-388, issn 0368-4466Conference Paper

Estimation of average heat capacities of condensed phase transformation products in the Y-Ba-Cu-O systemMOISEEV, G; VATOLIN, N; STEPANEK, B et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 469-476, issn 0368-4466Conference Paper

Estimation of melting (decomposition) heat of some compounds in the Y-Ba-Cu-O systemMOISEEV, G; VATOLIN, N; SESTAK, J et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 477-488, issn 0368-4466Conference Paper

Study of phase equilibria established up to the solidus line in the system Fe₂V₄O₁₃-WO₃WALCZAK, J; RYCHŁOWSKA-HIMMEL, I; MIKOS-NAWŁATYNA, E et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 427-431, issn 0368-4466Conference Paper

Calorimery in the science of building materialsUSHEROV-MARSHAK, A. V; SOPOV, V. P.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 497-504, issn 0368-4466Conference Paper

Comparative thermodynamic analysis of the binary system Bi-SbZIVKOVIC, Z. D; ZIVKOVIC, D; SESTAK, J et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 417-426, issn 0368-4466Conference Paper

Copper solubility and distribution in doped GaSb single crystalsSESTAK, J; STEPANEK, B; YOKOKAWA, H et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 389-397, issn 0368-4466Conference Paper

Novel growth methods of optoelectronic crystals based on antimonidesVENKRBEC, J. J; KOUSAL, J; STETINA, J et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 399-410, issn 0368-4466Conference Paper